AMSL’s New Machines Aim to Alleviate Chip Shortage for Samsung and TSMC

ASML recently announced that Samsung and TSMC will join Intel in utilizing its cutting-edge High NA extreme ultraviolet (EUV) lithography chip fabrication machines. The three industry leaders also introduced a collaborative initiative to implement larger 12-inch photomasks aimed at enhancing manufacturing efficiency and reducing chip production costs. Samsung is set to incorporate ASML’s NA EUV technology by 2028, while TSMC plans to follow suit by 2030. The new photomasks are projected to be integrated into advanced node production by 2033.

At present, Intel is the sole company using ASML’s High NA EUV technology for its 18A process on select Core Ultra Series 3 (Panther Lake) processors. The company is also developing an upgraded version called 18A-P, which is under consideration by Apple for the forthcoming A-series processors for iPhones. ASML proudly stated that Intel has produced over a million wafers utilizing this innovative process.

Now, both TSMC and Samsung, recognized as the leading and second-largest chip manufacturers globally, have pledged to adopt the High NA EUV technology. Samsung intends to manufacture DRAM memory products using this technology by 2028, while TSMC aims to initiate its deployment in advanced nodes starting in 2030. as demonstrated by Intel, transitioning to this advanced technology may present challenges that could delay production timelines for both companies.

ASML revealed a strategic initiative with TSMC and Samsung to transition to large-format 12-inch photomasks, which are essential for transferring chip designs onto wafers. This initiative comes as another significant chipmaker, SK Hynix, is considering joining the consortium. TSMC emphasized that the larger photomasks will enhance fabrication productivity, reduce chip manufacturing costs, and eliminate stitching limitations.

The introduction of these new masks will enable manufacturers to print the intricate details of the NA EUV process onto larger chips directly. Currently, chips produced with this process require features to be “stitched” together, a method that complicates manufacturing and increases expenses. The move to 12-inch photomasks will simplify this process, lowering both costs and complexity.

ASML plans to commence testing for 12-inch photomask fabs in 2031, with production anticipated to begin in 2033. “If we are to succeed as an industry, the productivity of these systems could increase by 40 percent,” stated ASML’s Chief Technology Officer Marco Pieters in a comment to Reuters.